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Wafer- Level Test

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  • Embedded Wafer Level Ball Grid Array — Prinzipskizze eWLB Embedded Wafer Level Ball Grid Array (eWLB) ist eine Gehäusebauform für integrierte Schaltungen, bei der die Gehäuseanschlüsse auf einem aus Chips und Vergussmasse künstlich hergestellten Wafer erzeugt werden. Inhaltsverze …   Deutsch Wikipedia

  • Parallel Parametric Test — is an emerging strategy for wafer level parametric testing that involves concurrent execution of multiple tests on multiple scribe line test structures. If offers the potential for increasing test throughput with existing test hardware, in… …   Wikipedia

  • Design For Test — (aka Design for Testability or DFT ) is a name for design techniques that add certain testability features to a microelectronic hardware product design. The premise of the added features is that they make it easier to develop and apply… …   Wikipedia

  • Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

  • Nasiri-Fabrication — Process The Nasiri Fabrication Process, patented by InvenSense, uses a wafer to wafer bonding process that allows for direct integration of the fabricated MEMS wafers to any off the shelf CMOS wafer at the wafer level. Although the wafer bonding… …   Wikipedia

  • Microelectromechanical system oscillator — Microelectromechanical system (MEMS) oscillators are timing devices that generate highly stable reference frequencies. These reference frequencies are used to sequence electronic systems, manage data transfer, define radio frequencies, and… …   Wikipedia

  • Integrierter Schaltkreis — Integrierter Schaltkreis. Das Chip Gehäuse wurde geöffnet und ermöglicht den Blick auf den eigentlichen Halbleiter. Die erkennbaren Strukturen im Zentrum sind die realisierte elektronische Schaltung. Im Außenbereich sind die goldenen… …   Deutsch Wikipedia

  • Probe card — A probe card is an interface between an electronic test system and a semiconductor wafer. Its purpose is to provide an electrical path between the test system and the circuits on the wafer, thereby permitting the testing and validation of the… …   Wikipedia

  • DDR4 SDRAM — This article is about DDR4 SDRAM. For graphics DDR4, see GDDR4. The first DDR4 memory module was manufactured by Samsung and announced in January 2011. In computing, DDR4 SDRAM, an abbreviation for double data rate type four synchronous dynamic… …   Wikipedia

  • Корпусирование ИС — Ранняя советская микросхема К1ЖГ453 Корпусирование интегральных схем  завершающая стадия микроэлектронного производства, в процессе которой полупроводниковый кристалл устанавливается в корпус. Обычно состоит из этапов прикрепления крис …   Википедия

  • Carbon nanotube — Not to be confused with Carbon fiber. Part of a series of articles on Nanomaterials Fullerenes …   Wikipedia

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